Product Name: Hemiao CNHM-3283 Electronic Fluorination Liquid (Equivalent Replacement of 3M FC-3283)
Main technical parameters of CNHM-3283
project | parameter |
apparent | Clarification, colorless |
smell | tasteless |
boiling point | 126℃ |
Density (25℃) | 1.85g/ml |
Dielectric constant (1 MHz) | 2.09 |
Dielectric strength (2.5MM) | >35.7kV |
Dielectric loss (1 MHz) | 0.00029 |
surface tension | 15.69mN/m |
freezing point | -82℃ |
Saturated steam pressure (20℃) | 1.516kPa |
critical pressure | 4.28MPa |
critical temperatures | 196.54℃ |
flash point | not have |
Ozone depletion potential value (ODP) | 0 |
Global Warming Potential Value (GWP) | 108 |
Specific heat (25℃) | 1.107J/(g.K) |
Thermal conductivity (25℃) | 0.0614W/(m.k) |
latent heat of vaporization | 82.8KJ/kg |
Motor viscosity (25℃) | 1.376mm2/s |
Volume resistivity (25℃) | ≥1×1015 Ω.mm |
CNHM-3283 Product Features
1. This product has ideal high insulation performance, high density, and high boiling point, and can be widely used in various temperature controlled heat dissipation systems;
2. Non hazardous materials are non flammable and non explosive, with no ignition point or flash point;
3. Good electrical insulation and extremely high breakdown voltage;
4. Low dielectric constant and dielectric loss, without affecting signal transmission;
5. Good fluidity, able to flow and dissipate heat well in the temperature control system;
6. Non toxic, harmless, and non irritating;
7. Environmentally friendly, with an extremely low GWP value and an ODP value of 0, without damaging ozone.
8. Insoluble with water to avoid damage to components caused by moisture.
CNHM-3283 Scope of Application
1. Heat transfer cooling working fluids for semiconductor dry etching, wafer testing, electronic reliability testing, packaging, etc;
2. Various data processing electronic equipment with thermal conductivity and cooling working fluids;
3. Electronic product cleaning agents; Insulation liquid
4. As an intermediate in the synthesis of fluorinated surfactants and other fluorinated chemicals;
5. Intrusive cooling of data center servers.